Cleaning kit. A practical tool designed to remove excess paper from wafer‑thin, chemically‑etched dies quickly and comfortably. The Die Brush features a sleek, ergonomic rubber‑grip handle that ensures easy, non‑slip maneuvering while rolling away leftover paper to reveal a clean die‑cut. The included foam pad provides the ideal work surface for brushing out small pieces from both the die and the cut shape.

This accessory is suitable for all brands of wafer‑thin dies and is especially useful when working with intricate Thinlits and Framelits designs.

Includes:

• 1 Die Brush
• 1 Foam Pad